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Compact, Adaptive Solutions Engineered for Reliable High-Speed Signal Integrity Under Dynamic Operating Conditions
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In today’s high-density electronic designs, maintaining stable high-speed connections under vibration, shock, and thermal expansion is a critical challenge. Traditional board-to-board connectors often struggle with misalignment and assembly stress, leading to unreliable performance. ATTEND’s Floating Board-to-Board Connectors are engineered to overcome these limitations, delivering robust flexibility and dependable signal integrity for demanding applications. |
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Floating Board-to-Board Connector series |
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ATTEND’s Floating Board-to-Board Connectors provide high-speed, reliable interconnects with an integrated floating mechanism that compensates ±0.5 mm X/Y misalignment. Supporting up to 8 GT/s (PCIe 3.0) and offered in 0.5 mm pitch with 60/80/100 contacts, the series reduces assembly stress, ensures stable contact under vibration and shock, and operates across –40°C to +105°C. Ideal for automotive electronics, industrial automation, AI and edge computing modules, railway systems, medical devices, and test equipment. |
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Essential Guide to Edge AI Connectivity in Harsh Environments
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As AI computing rapidly moves from controlled data centers to the unpredictable edge, connectivity becomes a decisive factor for system performance. Harsh conditions such as vibration, dust, moisture, and extreme temperatures put enormous pressure on connectors, often making them the weakest link in edge deployments. This guide explores the essential role of rugged, high-speed interconnects in enabling reliable AI systems at the edge, from industrial automation to transportation and smart cities. |
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Please get in touch with us for dedicated and efficient service and more product information, technical support, or quotes. |
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